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datashee t product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/27 tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com low noise quasi-resonant control dc/dc converter ic for ac/dc converter bd7682fj-lb bd7683fj-lb bd7684fj-lb bd7685fj-lb general description this is the product guarantees long time support in the industrial market. bd768xfj series is a quasi-resonant controller type dc/dc converters that provide an optimum system for all products that include an electrical outlet. quasi-resonant operation enables soft switching and helps to keep emi low. design with a high degree of flexibility is achieved with switching mosfets and current detection resistors as external devices. the built-in brown out function monitors the input voltage as part of system optimization. the burst mode function reduces input power at low power. bd768xfj series include various protection functions, such as a soft start function, burst function, per-cycle over-current limiter function, overvoltage protection function, overload protection function, and brown out function. bd768xfj series include a gate-clamp circuit for optimal driving sic-mosfet. features ? pin 8 : sop-j8 package (6.00mm 4.90mm : 1.27mm pitch ) ? quasi-resonant type (low emi) ? frequency reduction mode ? low current consumption (19a), during standby ? low current consumption when no load (burst operation when light load) ? maximum frequency (120khz) ? cs pin leading-edge blanking ? vcc uvlo (under voltage drop out protection) ? vcc ovp (over voltage protection) ? per-cycle over-current protection circuit ? soft start ? zt trigger mask function ? voltage protection function (brown out) ? zt ovp (over voltage protection) ? gate-clamp circuit typical application circuit key specifications ? operating power supply voltage range: vcc 15.0v to 27.5v ? normal operating current: 0.80ma(typ) ? burst operating current: 0.50ma(typ) ? maximum frequency: 120khz(typ) ? operating temperature: -40c to +105c package 4.90mm x 6.00mm x 1.65mm pitch 1.27mm (typ.) (typ.) (typ.) (typ.) lineup applications industrial equipment, ac adaptor, household appliances sop-j8 4.90mm x 6.00mm x 1.65mm downloaded from: http:///
2/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 pin descriptions no. pin name i/o function esd diode vcc gnd 1 zt i zero current detect pin - ? 2 fb i feedback signal input pin ? ? 3 cs i current sense pin ? ? 4 gnd i/o gnd pin ? - 5 out o mosfet drive pin ? ? 6 mask o external tr drive - ? 7 vcc i power supply pin - ? 8 bo o brown in/out monitor pin - ? block diagram downloaded from: http:///
3/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta= 25 c) parameter symbol rating unit conditions maximum applied voltage 1 v max1 -0.3 to +32.0 v out, vcc, mask maximum applied voltage 2 v max2 -0.3 to +6.5 v zt, cs, fb, bo maximum applied voltage 3 v max3 -0.3 to +25.0 v out zt pin maximum current1 i szt1 -3.0 ma zt pin maximum current2 i szt2 3.0 ma power dissipation p d 676 (note1) w operating temperature range t opr -40 to +105 c max junction temperature t jmax 150 c storage temperature range t str -55 to +150 c (note1) sop8 : when mounted (on 70 mm 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate) de-rated by 5.4mw/c when operating above ta=25c. caution : operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=25 ? c) parameter symbol rating unit conditions power supply voltage range v cc 15.0 to 27.5 v vcc pin voltage electrical characteristics (unless otherwise noted, ta = 25 c, v cc = 24 v) parameter symbol specifications unit conditions min typ max [circuit current] circuit current (off) i off 10 19 30 a v cc =18.0v (vcc uvlo=disable) circuit current (on) 1 i on1 300 800 1500 a fb=1.0v (at pulse operation) circuit current (on) 2 i on2 150 500 1000 a fb=0.0v (at burst operation) circuit current (protect circuit is on) i protect 800 1600 2200 a fbolp,vccovp,ztovp [brown out block (b.o.)] b.o. detection voltage v bo 0.920 1.000 1.080 v b.o. detection hysteresis current i bo 10 15 20 a [vcc pin protection functions] vcc uvlo voltage 1 v uvlo1 19.00 19.50 20.00 v vcc rise vcc uvlo voltage 2 v uvlo2 13.00 14.00 15.00 v vcc fall vcc uvlo hysteresis v uvlo3 - 5.50 - v v uvlo3= v uvlo1 -v uvlo2 vcc ovp voltage 1 v ovp1 27.50 29.50 31.50 v vcc rise vcc ovp voltage 2 v ovp2 21.00 23.00 25.00 v vcc fall vcc ovp hysteresis v ovp3 - 6.50 - v v ovp3 = v ovp1 -v ovp2 latch release voltage v latch - v uvlo2 -3.5 - v vcc voltage latch mask time t latch 50 150 250 s downloaded from: http:///
4/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics C continued (unless otherwise noted, ta = 25 c, v cc =24 v) parameter symbol specifications unit conditions min typ max [dcdc converter block (turn off)] fb pin pull-up resistance r fb 15 20 25 k ? cs over-current sensor voltage 1a v lim1a 0.950 1.000 1.050 v fb=2.2v (i zt >-1ma) cs over-current sensor voltage 1b v lim1b 0.620 0.700 0.780 v fb=2.2v (i zt <-1ma) cs over-current sensor voltage 2a v lim2a 0.200 0.300 0.400 v fb=0.6v (i zt >-1ma) cs over-current sensor voltage 2b v lim2b 0.140 0.210 0.280 v fb=0.6v (i zt <-1ma) cs switching zt current i zt 0.900 1.000 1.100 ma cs leading edge blanking time t leb - 0.250 - s minimum on width t min - 0.500 - s [dcdc converter block (turn on)] maximum operating frequency 1 f sw1 106 120 134 khz fb=2.0v maximum operating frequency 2 f sw2 20 30 40 khz fb=0.5v frequency reduction start fb voltage v fbsw1 1.100 1.250 1.400 v frequency reduction end fb voltage 1 v fbsw2 0.400 0.500 0.600 v frequency reduction end fb voltage 2 v fbsw3 - 0.550 - v voltage gain av cs 1.700 2.000 2.300 v/v S v fb / S v cs zt comparator voltage 1 v zt1 60 100 140 mv zt fall zt comparator voltage 2 v zt2 120 200 280 mv zt rise zt trigger mask time t ztmask 0.25 0.60 0.95 s for noise prevention after out h ? l zt trigger timeout period 1 t ztout 8.0 15.0 24.0 s count from final zt trigger (1-stage) zt trigger timeout period 2 t ztout2 2.0 5.0 8.0 s count from final zt trigger (2-stage) maximum on time t zton 27.0 45.0 62.0 s [dcdc protection functions] soft start time 1 t ss1 0.600 1.000 1.400 ms soft start time 2 t ss2 2.400 4.000 5.600 ms fb olp voltage 1 v folp1 2.500 2.800 3.100 v fb rise fb olp voltage 2 v folp2 2.300 2.600 2.900 v fb fall fb olp timer t folp 90 128 166 ms zt ovp voltage v ztl 3.250 3.500 3.750 v [out pin] out pin clamp voltage v out 16.00 18.00 20.00 v out pin nch mos ron r nout 2.0 4.5 9.0 ? [mask pin] mask pin delay time t mask 0.25 0.60 0.95 s mask pin ron r mask 20 50 80 ? downloaded from: http:///
5/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 application information description of blocks (1) start-up sequences (fbolp:auto recovery mode) the bd768xfjs start up sequence is shown in figure 1. see the sections below for detailed descriptions. vout switching vh vcc 19.5v fb soft start iout normal load light load 128msec 14.0v over load internal ref pull up burst mode bo volp1 ab c d 1.0v efg hi jk 128msec 128msec figure 1. start-up sequence timing chart a: input voltage vh is applied b: vcc pin voltage rises due to start resistor r start , and this ic starts operating when vcc > v uvlo1 (19.5v typ). switching starts when the status of the brown out function is normal (bo > 1.0 v), other protection functions are also considered normal. at that time, the vcc value always drops due to t he pin's consumption current, so v cc > v uvlo2 (14.0 v typ) should be set. c: there is a soft start function which regulates the voltage level at the cs pin to prevent a rise in voltage and current. d: when the switching operation starts, v out rises. once the output voltage starts, set the rated voltage to within the t folp period (128ms typ). e: when there is a light load, burst operation is order to keep power consumption down. f: overload operation. g: when the fb pin voltage keeps fb > v folp1 (=2.8v typ) at or above t folp (128ms typ), switching is stopped by the overload protection circuit. if the fb pin voltage status becomes fb < v folp1b even once, the ics internal 128ms timer is reset. h: if the vcc voltage drops to vcc < v uvlo2 (14.0v typ) or below, restart is executed. i: the ics circuit current is reduced and the vcc pin value rises. (same as b) j: same as f k: same as g start resistance r start is the resistance required to start the ic. when the start resistance r start value is reduced, standby power is incr eased and the startup time is shortened. conversely, when the start resistance r start value is increased, standby power is reduced and the startup time is lengthened. when bd768xfj is in standby mode, current i off becomes 30a max however, this is the minimum current required to star t the ic. use the appropriate current for the set target. example: start resistance r start setting ?? ?? off uvlo min start i/ max v v r ? ? when v ac = 100 v, if the margin is -20%, then v min = 113v since v uvlo1 (max) = 20.0v, and since r start < (113-20) / 30a = 3.10 m ? , the start resistance is 3.0m ? . (set according to the start time.) in this case: r start power consumption ? ? ? ? ? ? mw 4.5 m0.3/v14 v 141 r/ v v r pd 2 start 2 cc h start ? ? ? ? ? downloaded from: http:///
6/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (2) brown out function (b.o.) bd768xfj has a built-in brown out function. when the input vh value is low, the brown out function stops the dc/dc operations (the ic itself continue s to operate). an example is shown in figure 2. the input voltage which is resistance-divided is inputted to the bo pin. if the bo pin value exceeds v bo (1.0 v typ), the circuit detects as normal state, and dcdc operations are star ted. there is a current hysteresis i bo in the circuit. the current hysteresis flow is described below. ? bo < v bo (1.0 v typ) (abnormal) i bo with sync ? bo R v bo (1.0 v typ) (normal status) i bo without sync bo + \ 1.00v rh rl bo comp. vh controller 15ua bd768x fuse filter diode bridge figure 2. block diagram of brown out function example: r h and r l setting in the following example, v hon is the operation start v h voltage (l to h), and v hoff is the operation stop v h voltage (h to l). ic operation start (off => on) (v hon -1.0) /r h = 1.0/r l +15*10e-6 ic operation stop (on => off) (v hoff -1.0) /r h = 1.0/r l based on the above, r h and r l can be calculated as follows. ? ? ? ? ? ? h hoff l hoff hon h r*0.1 v /0.1 r,6 e10*15 / v v r ? ? ? ? ? example 1: when using 100 v ac (140 v dc) when r h = 2350k ? and r l = 34k ? , v hon = 105.8v (-25%) and v hoff = 70.8v (-51%) current consumption is 8.0mw for both r h and r l . example 2: when using 230v ac (322v dc) r h = 5200k ? , r l = 42k ? v hon = 202.8v (-37%), v hoff = 124.8v (-62%) current consumption is 20.1 mw for both r h and r l . 15a downloaded from: http:///
7/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (3) vcc pin protection function bd768xfj includes the vcc low voltage protection functi on vcc uvlo (under volta ge protection) and the vcc over voltage protection function vcc ovp (over vo ltage protection). these functions prevent abnormal voltage-related damage in mosfets used for switching. the vcc uvlo function uses an auto recovery type comparator with voltage hysteresis and the vcc ovp function uses latch mode or auto recovery. after latch function is detected by vccovp, la tching is released (reset) when the condition v cc < v latch (typ= v uvlo2 -3.5v) is met. this operation is shown in figure 3. vccovp has a built-in mask time t latch (typ = 150 s). this function masks any surges, et c., that occur at the pin. 18.5vtyp vcc off time on off on 29.5vtyp out switching 14.0vtyp vcc uvlo on off on off vcc ovp off on off a bc de f off internal latch signal l : normal h : latch vh g hi j k l m vlatch= vccuvlo2- 3.5vtyp n a time figure 3. vcc uvlo / ovp (latch mode) a: vh is applied, vcc voltage rises b: when vcc > v uvlo1 , dc/dc operation starts. c: when vcc < v uvlo2, dc/dc operation stops. d: when vcc > v uvlo1 , dc/dc operation starts. e: vcc voltage drops until dc/dc operation starts. f: vcc rises. f: when vcc > v ovp1, dc/dc operation stops (latch mode). switchi ng is stopped by an internal latch signal. g: when dc/dc operation stops, power supply from t he auxiliary coil stops and vcc voltage drops. h: when vcc < v uvlo2 , vcc voltage rises because ic current consumption drops. i: when vcc > v uvlo1 , latching occurs and so there are no dc/dc operations. vcc voltage drops because ic current consumption is lowered. k: same as h l: same as i m: vh is open (unplugged). vcc drops. n: when vcc < v latch, latch is released. downloaded from: http:///
8/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (4) dcdc converter function bd768xfj uses pfm (pulse frequency modulation) mode control. the fb pin, zt pin, and cs pin are all monito red to provide a system optimized for dc/dc. the switching mosfet on width (turn off) is controlled via the fb pin and cs pin, and the off width (turn on) is controlled via the zt pin. pfm mode sets the maximum frequency to meet noise standards. a detailed description appears below. (see figure 4) + + _ + > + + _ x + + + figure 4. block diagram of dc/dc operations downloaded from: http:///
9/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (a) determination of on width (turn off) on width is controlled via the fb pin and cs pin. the on width is determined by comparing fb pin voltage at 1/ av cs (typ = 1/2) with the cs pin voltage. in addition, it is compared with the ic's internally generated v lim1 (1.0v typ) voltage and the comparator level changes linearly, as is shown in figure 5. the cs pin is also used for the per-pulse over-current limiter circuit. changes at the fb pin result in changes in the maximu m blanking frequency and over-current limiter level. ? mode1: burst operation ? mode2: frequency reduction operation (reduces maximum frequency) ? mode3: maximum frequency operation (operates at maximum frequency) ? mode4: overload operation (pulse operation is stopped when overload is detected) ] x ] ] ] figure 5. relationship of fb pin to over-current limiter and maximum frequency the over-current limiter level is adjus ted for soft start function (section 5) and over-current protection of the input voltage compensation (section 4 (c)) in this case, the v lim1 and v lim2 values are as listed below. table 1 over-current protection voltage soft start i zt -1.0ma i zt < -1.0ma v lim1 v lim2 v lim1 v lim2 start to 1ms 0.250v (25.0%) 0.063v (6.0%) 0.175v (17.5%) 0.047v (4.5%) 1ms to 4ms 0.500v (50.0%) 0.125v (1 2.0%) 0.350v (35.0%) 0.094v (9.0%) >4ms 1.000v (100.0%) 0.250v (25.0%) 0.700v (70.0%) 0.188v (18.8%) (note) values in parentheses are relative values when compared to v lim1 (1.0v typ) during i zt -1.0ma. (b) leb (leading edge blanking) function when the switching mosfet is turned on, surge curre nt occur at each capacitor component and drive current. therefore, when the cs pin voltage rises temporar ily, detection errors may occur in the over-current limiter circuit. to prevent detection errors, bd768xfj has the blanking function. this function masks the cs voltage for t leb (typ = 250ns) after the out pin changes from low to high. this blanking function reduces cs pin filter. f sw [khz] v lim1 v lim2 downloaded from: http:///
10/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (c) cs over-current protection switching function when the input voltage (vh) becomes high, the on time is shortened and the oper ating frequency increases. as a result, the maximum rated power is increased for a certain over-current limiter. as a countermeasure, switching is performed by the ic's inte rnal over-current protection function. when at high voltage, the over-current comparator value which determines the on time is always multiplied by 0.7. detection is performed by monitoring the zt inflow current and then switching. when the mosfet is turned on, va becomes a negativ e voltage dependent upon the input voltage (vh). the zt pin is clamped to nearly 0v in the ic. the formula used to calculate this is shown below. a block diagram is shown in figure 6. also, graphs are shown in figure 7, figure 8 and figure 9. ? ? zt 1zt 1zt h 1zt 1zt zt\ zt i/va r r/np/na *v r/va r/ v va i ? ? ? ? ? therefore, the vh voltage is set with a resistance value (r ztl ). the zt bottom detection voltage has now been determined, so c zt should be used to set the timing. czt rzt va na np vh izt ? =(vh*na)/(np*rzt1) nout + \ + ? leading ? edge blanking 5 out gnd vcc cs zt zt ? comp. ? rs czt fb vref(4v) 3 1 7 4 2 timer (128ms) fbolp_oh + \ 100mv /400mv 1 ? shot cfb rzt1 7v and nout timeout ( ? 15 ? usec ? ) and and pre driver pout fb/2 + \\ dcdc ? comp. ? 1.00v current ? sense ? (v \ v ? change) normal ? : ? 1.0 + \ fbolp_oh 1.00v ? 0.50v + \ olp1 osc 200ko 200ko burst comp. soft ? start or or 20k mask 0.5s delay 6 nor + \ zt ? acsns ? comp. ? ss1ms ss4ms rzt2 + \ zt ? ovp ? comp. ? (latch) s q r nout 18v clamper max ? blanking frequency (120khz) zt ? blanking out(h \ >l) 0.60us figure 6. block diagram of cs switching current downloaded from: http:///
11/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 figure 7. cs switching: fb voltage vs cs voltage figure 8. cs switching: zt current vs cs voltage example: setup method (for switchin g between 100-v ac and 220-v ac.) 100-v ac: 141v 42v (30% margin) 220-v ac: 308v 62v (20% margin) in the above cases, the cs current is switched in the range from 182v to 246v. this is done when => vh = 214 vh. given: np = 100, na = 15. ? ? ? k1.32 ma 1/v1.32 i/va r v1.32 1 * 100 /15*v 214 np/na * v va zt zc in ? ? ?? ? ? ? ? ? ? according to the above, r zt = 32 k ? is set. x y vh[v] 214v cs limiter[v] vlim1 vlim1*0.7 figure 9. cs switching: vh voltage vs cs voltage i z t [ma] v lim1 v lim1 * 0.8 downloaded from: http:///
12/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (d) determination of off width (turn on) off width is controlled at the zt pin. when switching is off, the power stored in the coil is supplied to the secondary-side output capacitor. when this power supply ends, there is no more current flowing to the secondary side, so the switching mos drain pin voltage drops. consequently, the voltage on the auxiliary coil side also drops. a voltage that was resistance-divided from the zt pin by r zt1 and r zt2 is applied. when this voltage level drops to v zt1 (100 mv typ) or below, switching is turned on by the zt comparator. since zero current status is detected at the zt pin, time constants are generated using c zt , r zt1 , and r zt2 . additionally, a zt trigger mask function (described in section 4 (e)) and a zt timeout function (described in section 4 (f)) are built in. (e) zt trigger mask function (figure 10) when switching is set on / off, superpositi on of noise may occur at the zt pin. at this time, the zt comparator is masked for the t ztmask time to prevent zt comparator operation errors. figure 10. zt trigger mask function a: dc/dc off=>on b: dc/dc on=>off c: noise occurs at zt pin, and zt comparator is not operated by t ztmask . d: same as a e: same as b f: same as c g: same as a downloaded from: http:///
13/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (f) zt timeout function ? zt timeout function1 when zt pin voltage is not higher than v zt2 (typ=200mv) for t ztout1 (typ=15s) such as start or low output voltage, zt pin short, ic turns on mosfet by force. ? zt timeout function 2 after zt comparator detects bottom, ic turns on mo sfet by force when ic does not detect next bottom within t ztout2 (typ =5s). after zt comparator detects botto m at once, the function operates. for that, it does not operate at start or at low output voltage. when ic is not able to detect bottom by decreasing auxiliary winding voltage, the function operates. figure 11. zt time-out function a: at starting, ic starts to operat e by zt timeout function1 for zt=0v. b: mosfet turns on c: mosfet turns off d: zt voltage is lower than v zt2 (typ=200mv) by zt dump decreasing. e: mosfet turns on by zt timeout fucntion2 after t zt2 (typ=5s) from d point. f: zt voltage is lower than v zt2 (typ=200mv) by zt dump decreasing. g: mosfet turns on by zt timeout fucntion2 after t zt2 (typ=5s) from f point. h: zt pin is short to gnd. i : mosfet turns on by zt timeout function1 after t ztout1 (typ=15s) downloaded from: http:///
14/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (5) soft start operations normally, a large current starts flowing to the ac/dc power supply when the ac power supply is turned on. bd768xfj includes a soft start function to prevent large changes in the output voltage and output current during startup. this function is reset when the vcc pin voltage is at v uvlo2 (7.5v typ) or below, or when the bo pin is at the b.o. detection voltage (1.00v typ) or below (that is, when the ac power supply is unplugged), and soft start is performed again at the next ac power-on. during a soft start, the following post-startup operations are performed. ( see turn off described above in section 4 (a)). ? start to 1ms => set to 25% of normal cs limiter value ? 1ms to 4ms => set to 50% of normal cs limiter value ? > 4 ms => normal operation (6) over load protection function the overload protection function monitors the overload st atus of the secondary output current at the fb pin, and fixes the out pin at low level when overload status is detected. during overload status, current no longer flows to the photo-coupler, so the fb pin voltage rises. when this status continues for the t folp time (128ms typ), it is considered an overload and the out pin is fixed at low level. once the fb pin voltage exceeds v folp1 (2.8v typ), if it drops to lower than v folp2 (2.6v typ) within the t folp time (128ms typ), the overload protection timer is reset. at startup, the fb voltage is pulled up to the internal voltage by a pull-up resistor and operation starts once the voltage reaches v folp1 (2.8v typ) or above. ther efore, the design must be set the fb voltage at v folp2 (2.6v typ) or below within the t folp (128ms typ) time. in other words, the secondary output volt age start time must be set to within t folp (128ms typ) after ic startup. to release latching after selecting latch mode, first unplug the power supply, and then set v cc < v latch (typ= v uvlo2 -3.5v) (7) zt pin ovp (over voltage protection) zt ovp (over voltage protection) function is built in for zt pin. when the zt pin voltage reaches v ztl (typ = 3.5v), overvoltage status is detected. zt pin ovp protection is performed in latch mode. a mask time defined as t latch (typ = 150s) is built in for the zt pin ovp function. when zt ovp status continues within 150 s, overvoltage is detect ed. this function masks any surges (etc .) that occur at the pin. see the illustration in figure 12. (a similar t latch (typ = 150s) is vccovp) figure 12. ztovp and latch mask function a: dc/dc pulse operation, zt pi n also has pulse operation b: zt pin voltage > v ztl (typ = 3.5v) c: zt pin voltage > v ztl (typ = 3.5v) status is within t latch (typ = 150s) period, so dc/dc normal operations are reset d: zt pin voltage > v ztl (typ = 3.5v) e: zt pin voltage > v ztl (typ = 3.5v) status continues for t latch (typ = 150s), so latching occurs and dc/dc off is set ? t 1 15/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (8) mask pin function the mask pin is used for control that maintains consta nt voltage at the bd768xfj's power supply pin (vcc pin). figure 13 shows an application diagram using t he mask signal. at the timing of dc/dc on => off swit ching, a surge voltage in the auxiliary coil makes va pin voltage rise. this also causes the vcc pin voltage to rise. the mask pi n outputs a signal that has been delayed by the time t mask relative to the out pin. (see figure 14) the mask pin is an open drain output, and an external transist or is used for on/off control. this function is able to maintain a constant vcc pin voltage. during a soft start, the mask pin is fixed at hiz level. consequently, the external transistor status is on. (see figure 13) leave open when not using the mask pin. figure 13. application circuit example using mask pin (note) in case of low output power, it isnt much power from the aux. window to vcc pin. please adjust a set value. downloaded from: http:///
16/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 figure 14. mask pin timing chart (normal operation) a : dc/dc off=>on b : dc/dc on=>off c : during tmask time, mask pin is l figure 15. mask pin timing chart (soft start operation) a: dc/dc off => on b: dc/dc on => off c: mask pin is fixed at hiz level. downloaded from: http:///
17/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (9) out pin gate clamp circuit out pin is connected to external mosfets gates. for mosfets gates is safety, out voltage is clamped to gate clamp circuit. (10) thermal shut-down function thermal shut-down function is auto restart type. when vcc uvlo is released, bd768xfj starts on state2 because of preventing from thermal error of external parts. at start up, it does not start until t1 below. figure 16. thermal shut-down protection circuit operation modes table 2 below lists the operation modes of the various protection functions. table 2 protection circuit operation modes item operation mode brown out protection auto recovery vcc under voltage locked out auto recovery vcc over voltage protection bd7682/7684 = auto recovery bd7683/7685 = latch fb over limited protection bd7682/7683 = auto recovery bd7684/7685 = latch zt over voltage protection latch downloaded from: http:///
18/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 power dissipation the thermal design should be set operation for the following conditions. (since the temperature shown below is the guaranteed tem perature, be sure to take a margin into account.) 1. the ambient temperature ta must be 105c or less. 2. the ics loss must be within the allowable dissipation pd. the thermal dissipation characteristics are as follows. (pcb: 70 mm 70mm 1.6 mm, mounted on glass epoxy substrate) figure 17. sop-j8 thermal de-rating curve pd[mw] ta[ ] downloaded from: http:///
19/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 i/o equivalent circuit downloaded from: http:///
20/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 10.0 15.0 20.0 25.0 30.0 35.0 40.0 -40 -20 0 20 40 60 80 100 120 circuit current (off) [ua] tempature [ ] 300 450 600 750 900 1050 1200 1350 1500 -40 -20 0 20 40 60 80 100 120 circuit current (on) 1 [ua] tempature [ ] 150 250 350 450 550 650 750 850 950 -40 -20 0 20 40 60 80 100 120 circuit current (on) 2 [ua] tempature [ ] 0.920 0.940 0.960 0.980 1.000 1.020 1.040 1.060 1.080 -40 -20 0 20 40 60 80 100 120 b.o. detection voltage [v] tempature [ ] 19.00 19.10 19.20 19.30 19.40 19.50 19.60 19.70 19.80 19.90 20.00 -40 -20 0 20 40 60 80 100 120 vcc uvlo voltage 1 [v] tempature [ ] 13.50 13.60 13.70 13.80 13.90 14.00 14.10 14.20 14.30 14.40 14.50 -40 -20 0 20 40 60 80 100 120 vcc uvlo voltage 2 [v] tempature [ ] 5.00 5.10 5.20 5.30 5.40 5.50 5.60 5.70 5.80 5.90 6.00 -40 -20 0 20 40 60 80 100 120 vcc uvlo hysteresis [v] tempature [ ] 27.50 28.00 28.50 29.00 29.50 30.00 30.50 -40 -20 0 20 40 60 80 100 120 vcc ovp voltage 1 [v] tempature [ ] 15.0 17.0 19.0 21.0 23.0 25.0 -40 -20 0 20 40 60 80 100 120 fb pin pull-up resistance [k ? ] tempature [ ] 10.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 -40 -20 0 20 40 60 80 100 120 b.o. detect. hysteresis current [ua] tempature [ ] 0.950 0.960 0.970 0.980 0.990 1.000 1.010 1.020 1.030 1.040 1.050 -40 -20 0 20 40 60 80 100 120 cs over-current sensor volt. 1a [v] tempature [ ] 1200 1400 1600 1800 2000 -40 -20 0 20 40 60 80 100 120 circuit current (protect circuit is on) [ua] tempature [ ] characteristic data ( they are only reference data ) circuit current (off) circuit current (on) 1 circuit current (on) 2 circuit current (protect circuit is on) b.o. detection voltage b.o. detection hysteresis current vcc uvlo voltage 1 vcc uvlo voltage 2 vcc uvlo hysteresis vcc ovp voltage 1 fb pin pull-up resistance cs over-current sensor voltage 1a downloaded from: http:///
21/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 0.245 0.260 0.275 0.290 0.305 0.320 0.335 0.350 -40 -20 0 20 40 60 80 100 120 cs over-current sensor voltage 2a [v] tempature [ ] 0.170 0.180 0.190 0.200 0.210 0.220 0.230 0.240 0.250 -40 -20 0 20 40 60 80 100 120 cs over-current sensor voltage 2b [v] tempature [ ] 0.100 0.250 0.400 0.550 0.700 0.850 -40 -20 0 20 40 60 80 100 120 minimum on width [us] tempature [ ] 106.0 111.0 116.0 121.0 126.0 131.0 136.0 -40 -20 0 20 40 60 80 100 120 maximum operating frequency 1 [khz] tempature [ ] 24.0 26.0 28.0 30.0 32.0 34.0 36.0 -40 -20 0 20 40 60 80 100 120 maximum operating frequency 2 [khz] tempature [ ] 1.100 1.150 1.200 1.250 1.300 1.350 1.400 -40 -20 0 20 40 60 80 100 120 frequency reduction start fb voltage [ v] tempature [ ] 0.400 0.450 0.500 0.550 0.600 -40 -20 0 20 40 60 80 100 120 frequency reduction end fb voltage 1 [v] tempature [ ] 0.400 0.450 0.500 0.550 0.600 0.650 -40 -20 0 20 40 60 80 100 120 frequency reduction end fb voltage 2 [v] tempature [ ] 1.700 1.800 1.900 2.000 2.100 2.200 2.300 -40 -20 0 20 40 60 80 100 120 voltage gain [v/v] tempature [ ] 60.0 70.0 80.0 90.0 100.0 110.0 120.0 130.0 140.0 -40 -20 0 20 40 60 80 100 120 zt comparator voltage 1 [mv] tempature [ ] 0.650 0.660 0.670 0.680 0.690 0.700 0.710 0.720 0.730 0.740 -40 -20 0 20 40 60 80 100 120 cs over-current sensor voltage 1b [v] tempature [ ] 0.90 0.92 0.94 0.96 0.98 1.00 1.02 1.04 1.06 1.08 1.10 -40 -20 0 20 40 60 80 100 120 cs switching zt current [ma] tempature [ ] characteristic data ( they are only reference data ) cs over-current sensor voltage 1b cs over-current sensor voltage 2a cs over-current sensor voltage 2b cs switching zt current minimum on width maximum operating frequency 1 maximum operating frequency 2 frequency reduction start fb voltage frequency reduction end fb voltage 1 frequency reduction end fb voltage 2 voltage gain zt comparator voltage 1 downloaded from: http:///
22/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 9.0 11.0 13.0 15.0 17.0 19.0 21.0 -40 -20 0 20 40 60 80 100 120 zt trigger timeout period 1 [us] tempature [ ] 27.0 30.0 33.0 36.0 39.0 42.0 45.0 48.0 51.0 54.0 -40 -20 0 20 40 60 80 100 120 maximum on time [us] tempature [ ] 0.600 0.700 0.800 0.900 1.000 1.100 1.200 1.300 1.400 -40 -20 0 20 40 60 80 100 120 soft start time 1 [ms] tempature [ ] 2.400 2.800 3.200 3.600 4.000 4.400 4.800 5.200 5.600 -40 -20 0 20 40 60 80 100 120 soft start time 2 [ms] tempature [ ] 2.500 2.600 2.700 2.800 2.900 3.000 3.100 -40 -20 0 20 40 60 80 100 120 fb olp voltage 1 [v] tempature [ ] 2.300 2.400 2.500 2.600 2.700 2.800 2.900 -40 -20 0 20 40 60 80 100 120 fb olp voltage 2 [v] tempature [ ] 90.0 105.0 120.0 135.0 150.0 165.0 -40 -20 0 20 40 60 80 100 120 fb olp timer [ms] tempature [ ] 16.00 16.50 17.00 17.50 18.00 18.50 19.00 19.50 20.00 -40 -20 0 20 40 60 80 100 120 out pin clamp voltage [v] tempature [ ] 2.00 3.50 5.00 6.50 8.00 9.50 -40 -20 0 20 40 60 80 100 120 out pin nch mos ron [ ? ] tempature [ ] 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -40 -20 0 20 40 60 80 100 120 mask pin delay time [ns] tempature [ ] 20.0 30.0 40.0 50.0 60.0 70.0 80.0 -40 -20 0 20 40 60 80 100 120 mask pin ron [ ? ] tempature [ ] 3.00 3.10 3.20 3.30 3.40 3.50 3.60 3.70 3.80 3.90 4.00 -40 -20 0 20 40 60 80 100 120 zt ovp voltage [v] tempature [ ] characteristic data ( they are only reference data ) zt trigger mask time maximum on time soft start time 1 soft start time 2 fb olp voltage 1 fb olp voltage 2 fb olp timer zt ovp voltage out pin clamp voltage out pin nch mos ron mask pin delay time mask pin ron downloaded from: http:///
23/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and su pply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground trac es, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the grou nd traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special cons ideration to power coupling capacitance, po wer wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a ca pacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removi ng it from the test setup dur ing the inspection process. to prevent damage from static dischar ge, ground the ic during assembly and us e similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mount ing the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input terminals input terminals of an ic are often connected to the gate of a mo s transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electr ic field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conducti on through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused i nput terminals should be connected to the power supply or ground line. downloaded from: http:///
24/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 12. regarding input pins of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of th e p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 17. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that th e output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however th e rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. the ic should be powered down and turned on again to resume normal operation bec ause the tsd circuit keeps the outputs at the off state even if the tj falls below the tsd thres hold. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, shoul d the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 16. over-current protection circuit (ocp) this ic has a built-in overcurrent protecti on circuit that activates when the output is accidentally shorted. however, it is strongly advised not to subject the ic to prolonged shorting of the output. downloaded from: http:///
25/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 ordering information b d 7 6 8 x f j - lbe 2 product name package fj : sop-j8s product class lb for industrial applications packaging and forming specification e2: embossed tape and reel marking diagram sop-j8 (top view) part number marking lot numbe r 1pin mark d768 downloaded from: http:///
26/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name sop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
27/27 datasheet d a t a s h e e t bd768xfj-lb series tsz02201-0f1f0a200050-1-2 17.apr.2015. rev.001 ? 2015 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 23.mar.2015 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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